FA Engineer

San Jose, CA

Posted: 10/21/2019 Employment Type: Direct Hire Industry: Semiconductor Job Number: j-2213

Job Description

Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging team, and work directly with and support multiple product support and R&D teams. 

Position requires a technical specialist to support the packaging team in the functions performing electrical testing, physical characterization, and failure analysis on packaged devices and wafer level semiconductors directly contributing to the development of a variety of next-gen packaging solutions for the company’s WSD.  


  • Respond to failure analysis and packaging characterization requests such as performing:  
  • ET and fault isolation  
  • PCB and die metrology, compile measurements in readable format  
  • X-ray and CSAM of packages  
  • Module decap, backlap  
  • Wirebond analysis: wire loop measurement, ball shear, wire pull and failure mode documentation  
  • Bump/ball shear measurements and failure modes  
  • Sample preparation, cross-section and ion-milling  
  • White light interferometry to measure surface/bump topography  
  • Prepare detailed FA reports and updates for all of the above  
  • Coordinate scheduling FA jobs with external analytical services  
  • Offer technical support (super user on metrology equipment) to other technicians / users  
  • Create and maintain a database with log of analysis jobs and relevant reports  
  • Manage maintenance and use of in-house analytical equipment  
  • Keep current with new FA techniques, tools and provide input to add analytical capability to existing facilities 


  • Bachelor’s degree required  
  • 2+ years of experience in failure analysis and material analysis labs, extensive experience in electronics packaging  
  • Solid technical understanding of full range of Semiconductor packaging materials, material interactions, processes, dominant failure mechanisms and analytical techniques  
  • Demonstrated proficiency in some most common analytical/metrology tools;  
  • Optical microscopes, Compound microscopes and metallographs  
  • Sample preparation and Cross-sectioning / polishing  
  • Ability to use X-ray, Ultrasound scan (C-Scan/T-scan) systems and interpret data  
  • Digital camera use and image processing  
  • Use of tester for die shear, wire pull, ball/bump shear, etc  
  • Experience with SEM/EDS and FIB tools  
  • Surface analysis tools: interferometry, IR imaging  
  • Mold compound decap tools  
  • Ability to use statistical tools such as JMP is preferred but not required  
  • Knowledge of quality/reliability test methods, and debugging test fails, a plus  
  • Ability to use Microsoft office (especially powerpoint and excel) to present data  
  • Excellent written and verbal (English) communication skills 

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