Electrical Engineer Manager

Cupertino, CA | Direct Hire

Post Date: 09/27/2017 Job ID: 2002 Industry: Software/Hardware

Performs design and design related research and development and technical development activities on Printed
Circuit Board Assemblies (PCBAs) which will lead to new or improved products under specific marketing, cost,
time and regulatory constraints.
Summary of Primary Responsibilities:
The Electrical Engineering Manager position will be responsible for both the general and detailed electrical
component and assembly design, calculation, and engineering for hand held electronic medical devices.
Position Description and Responsibilities:
Essential Functions performed with moderate direction from supervisor
Must efficiently and effectively:
- Provide technical leadership to design team and help team-members organize thinking around:
o Electrical system topology, interconnectivity, communication platforms and constraints
o Design configuration(s) and trade-offs
o Detailed engineering requirements for the EE discipline;
- Generate Engineering calculations in support of detailed electrical component selection, system integration,
circuit schematic capture, GRBR-file development/review, power budgets, component tolerance, MTBF
calculations, stress estimation, Bill-of-Material generation, Net-List development/review, thermal equilibria,
battery energy consumption and form-factor analysis;
- Generate electrical schematic capture diagrams in either OrCAD or Altium, for use in fundamental analysis
of signal processing and I/O (pin-out) configuration(s);
- Develop detailed Hardware Requirements Specifications (HDS) for PCBA construction, quotation and P.O.
- Develop draft-level protocols for specific tests in support of robust electrical designs, targeting power and
ground-plane stabilities, ESD robustness, and interconnectivity reliability;
- Perform electrical power-budget calculations, component tolerance analysis, and simulation (SPICE)
analysis of design solutions;
- Perform the above functions in relation to project schedules throughout the Concept, Design, Verification,
and Validation process;
- Partner with project assigned ME resources to create 3-D solid models of PCBAs for form-factor analysis;
- Create / review PCB drill-files
- Utilize analytical techniques for passive component tolerancing and trade-off analysis;
- Fundamental Familiarity with fabrication techniques for BGA, SMT, and hand-soldering of PCBAs using
components as small as 0201 to 01005 form-factor package sizing;
- Familiarity and ability to perform failure modes and effects analysis (FMEA)
- Ability to thoroughly document design decision history, test and observation activities in a formal manner
using either Project Notes or Formal Test Reports
- Build, Test and evaluate PCBA prototypes
Additional Responsibilities
- Write draft design verification/validation protocols
- Write draft design verification/validation reports
- Seek the appropriate incremental approvals in a cross-functional team environment
- Interface with other internal and external departments affected by design and development
Position Qualifications:
- Minimum of M.S./B.S. Electrical Engineering or Electro-Magnetic Physics;
- 7+ years design experience resulting in 1 or more electro-mechanical products on the market;
- 5+ years’ experience in an ISO13485 regulated environment with good knowledge of ISO14971 application
of risk management techniques;
- 4+ years EE-CAD (OrCAD / Altium), OR 4+ years on other industry accepted 3-D CAD system;
- Knowledgeable concerning wired and wireless transmission protocols for 802.11(x), Wired/less USB (2, 3,
&C), Zigby, Bluetooth;
- Knowledgeable concerning printed circuit board prototyping, system “keep-out” generation and EE/MEassembly
- Working knowledge of QSR/ISO Quality System Requirements
- Working knowledge of Good Laboratory Practices (GLP)
- Working knowledge of ANSI drafting practices
- Must enjoy working in a fast paced, work intensive, and milestone driven culture.
- Must have experience in designing with a variety of passive, active, SOC, FPGA, FET, RAM, EEPROM and
SBC-connector technologies;
- Must have basic knowledge of fabrication processes including, solder wave-oven, BGA assembly, LED
illumination, and adhesive systems.
- Must be capable of cause and effect analysis and description techniques such as Ishikawa diagrams, Pugh
Charts, Pareto analysis, and Process Flow diagrams.
- Must fully understand material data sheets, stress, strain, thermal, and chemical resistance.
- Must be capable of working with peers and subordinates on a multidisciplinary team.
- Working knowledge of fundamental applied photographic optics and the application of these techniques to
micro-machine vision systems and their associated production documentation.
Supervision: Technician and Assembler(s)
Supervised by: Executive or Manager
This job description in no way states or implies that these are the only duties to be performed by this employee.
He or she will be required to follow any other instructions and to perform any other duties requested by his or her
supervisor or the management of the company.
- M.S./B.S. Electrical Engineering or Electro-Magnetic Physics.

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